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Thermal and mechanical behavior of copper molds during thin-slab casting (I): Plant trial and mathematical modeling

Joong Kil Park, Indira V. Samarasekera, Brian G. Thomas, U. Sok Yoon

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Source: Crossref

Published: Jun 1, 2002

DOI: 10.1007/s11663-002-0054-x

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Thermal and mechanical behavior of copper molds during thin-slab casting (I): Plant trial and mathematical modeling — Mathematical Frontier Network